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LTC4449 Datasheet(PDF) 12 Page - Analog Devices

Part # LTC4449
Description  150V Dual High-Side MOSFET Gate Driver
PDF  14 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTC4449 Datasheet(HTML) 12 Page - Analog Devices

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LTC7067
12
Rev. 0
For more information www.analog.com
APPLICATIONS INFORMATION
Unlike a pure capacitive load, a power MOSFET’s gate
capacitance seen by the driver output varies with its VGS
voltage level during switching. A MOSFET’s capacitive
load power dissipation can be calculated using its gate
charge, QG. The QG value corresponding to the MOSFET’s
VGS value (VCC in this case) can be readily obtained
from the manufacturer’s QG vs VGS curves. For identical
MOSFETs on G2 and G1:
PQG ≈ 2(QG)(fIN)(VCC)
BYPASSING AND GROUNDING
The LTC7067 requires proper bypassing on the VCC,
VG1VCC-G1RTN and VG2VCC-G2RTN supplies due to its high
speed Switching (nanoseconds) and large AC currents
(amperes). Careless component placement and PCB trace
routingmaycauseexcessiveringingandunder/overshoot.
To obtain the optimum performance form the LTC7067:
• Mount the bypass capacitors as close as possible
between the VCC and SGND pins, the G2VCC and
G2RTN pins, and the G1VCC and G1RTN pins. The leads
should be shortened as much as possible to reduce
lead inductance.
• Use a low inductance, low impedance ground place
to reduce any ground drop and stray capacitance.
Remember that the LTC7067 switches greater than
5A peak currents and any significant ground drop will
degrade signal integrity.
• Plan the power/ground routing carefully. Know where
the large load switching current is coming from and
going to. Maintain separate ground return paths for
the input pin and the output power stage.
• Kelvin connect the G1 pin to the G1 MOSFET gate and
G1RTN pin to the G1 MOSFET source. Kelvin connect
the G2 pin to the G2 MOSFET gate and G2RTN to the
G2 MOSFET source. Keep the copper trace between the
driver output pin and load short and wide.
• Be sure to solder the Exposed Pad on the back side of
the LTC7067 packages to the board. Failure to make
good thermal contact between the exposed back side
and the copper board will result in thermal resistances
far greater than specified for the packages.



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