SY75602A/02B/603A/03B/604A/04B

DS20006508B-page 18

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2021 Microchip Technology Inc. and its subsidiaries

16-Lead VQFN 3.0 mm x 3.0 mm Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

0.10

C A B

0.05

C

C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

1

2

N

0.10

C A B

0.10

C A B

0.10 C

0.08 C

Sheet 1 of 2

2X

16X

For the most current package drawings, please see the Microchip Packaging Specification located at

Note:

http://www.microchip.com/packaging

16-Lead Very Thin Quad Flat, No Lead Package (4MX) - 3x3x0.9 mm Body [VQFN]

With 1.10 mm Exposed Pad and Stepped Wettable Flanks

Microchip Technology Drawing C04-508 Rev A

SECTION A–A

AA

NOTE1

(DATUM B)

(DATUM A)

NOTE 1

SEATING

PLANE

A1

(A3)

A

D2

E2

D

E

e

16X b

(D3)

A4

L

e

2

1

2

N