SY75602A/02B/603A/03B/604A/04B

DS20006508B-page 16

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2021 Microchip Technology Inc. and its subsidiaries

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

A3

e

L

E

N

0.40 BSC

0.203 REF

0.30

0.15

0.80

0.00

0.20

0.40

0.85

0.02

1.40 BSC

MILLIMETERS

MIN

NOM

8

0.50

0.25

0.90

0.05

MAX

Overall Length

D

1.60 BSC

Wettable Flank Step Length

D3

0.05 REF

A4

–

0.10

–

Wettable Flank Step Height

8-Lead Very Thin Dual Flat, No Lead Package (NNC) - 1.6x1.4x0.9 mm Body [VDFN]

With Stepped Wettable Flanks

Microchip Technology Drawing C04-25509 Rev A