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2021 Microchip Technology Inc. and its subsidiaries

DS20006508B-page 19

SY75602A/02B/603A/03B/604A/04B

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.50 BSC

0.203 REF

0.25

0.20

0.80

0.00

0.25

0.35

0.85

0.02

MILLIMETERS

MIN

NOM

16

0.45

0.30

0.90

0.05

MAX

Overall Length

Exposed Pad Length

D

D2

1.00

3.00 BSC

1.10

1.20

Wettable Flank Step Length

D3

0.05 REF

A4

-

0.10

0.19

Wettable Flank Step Height

1.00

3.00 BSC

1.10

1.20

16-Lead Very Thin Quad Flat, No Lead Package (4MX) - 3x3x0.9 mm Body [VQFN]

With 1.10 mm Exposed Pad and Stepped Wettable Flanks

Microchip Technology Drawing C04-508 Rev A