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SY75604B Datasheet(PDF) 5 Page - Microchip Technology

Part # SY75604B
Description  2/4 Outputs Ultra-Low Additive Jitter PCIe 1/2/3/4/5 Clock Buffer
PDF  26 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SY75604B Datasheet(HTML) 5 Page - Microchip Technology

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2021 Microchip Technology Inc. and its subsidiaries
DS20006508B-page 5
SY75602A/02B/603A/03B/604A/04B
Clock Source DC Impedance (OUTx_n) for
part with 85Ω embedded differential series
resistance (parts with suffix “A”)
ZC-DC_OUT_n
34
—
51
Ω
Note 1, Note 9
Clock Source DC Impedance (OUTx_p) for
part with 100Ω embedded differential series
resistance (parts with suffix “B”)
ZC-DC_OUT_p
40
—
60
Ω
Note 1, Note 9
Clock Source DC Impedance (OUTx_n) for
part with 100Ω embedded differential series
resistance (parts with suffix “B”)
ZC-DC_OUT_n
40
—
60
Ω
Note 1, Note 9
Output Frequency
FMAX
0
—
250
MHz —
Output to Output Skew
tOOSK
—
—
30
ps
—
Device to Device Output Skew
tPOOSK
—
—
50
ps
—
Input to Output Delay
tIOD
0.9
1.2
1.5
ns
—
Output Enable Time
tEN
—
—
3.5
cycles Note 12
Output Disable Time
tDIS
—
—
4.5
cycles Note 12
Note 1: Measurement taken from single ended waveform.
2: Measurement taken from differential waveform.
3: Measured from –150 mV to +150 mV on the differential waveform (derived from OUTx_p to OUTx_n). The
signal must be monotonic through the measurement region for rise and fall time. The 300 mV
measurement window is centered on the differential zero crossing. See Figure 1-5.
4: Measured at crossing point where the instantaneous voltage value of the rising edge of OUTx_p equals
the falling edge of OUTx_n. See Figure 1-1.
5: Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is
crossing. Refers to all crossing points for this measurement. See Figure 1-1.
6: Defined as the maximum instantaneous voltage including overshoot. See Figure 1-1.
7: Defined as the minimum instantaneous voltage including undershoot. See Figure 1-1.
8: Defined as the total variation of all crossing voltages of Rising OUTx_p and Falling OUTx_n. This is the
maximum allowed variance in VCROSS for any particular system. See Figure 1-2.
9: System board compliance measurements must use the test load card described in Figure 1-7. OUTx_p
and OUTx_n are to be measured at the load capacitors CLOAD. Single-ended probes must be used for
measurements requiring single-ended measurements. Either single-ended probes with math or differential
probe can be used for differential measurements.
10: tSTABLE is the time the differential clock must maintain a minimum ±150 mV differential voltage after
rising/falling edges before it is allowed to droop back into the VRB ±100 mV differential range.
See Figure 1-6.
11: Matching applies to rising edge rate for OUTx_p and falling edge rate for OUTx_n. It is measured using a
±75 mV window centered on the median cross point where OUTx_p rising meets OUTx_n falling. The
median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate
calculations. The Rise Edge Rate of OUTx_p should be compared to the Fall Edge Rate of OUTx_n; the
maximum allowed difference should not exceed 20% of the slowest edge rate. See Figure 1-3.
12: Output Enable control pins are synchronous with the input clock and it takes four rising edges before out-
puts get enabled and five rising edges before outputs get disabled. Hence the minimum input frequency is
greater than 0 Hz. Once the outputs are enabled the input clock frequency can be reduced to 0 Hz.
OUTPUT ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 3.3V ±10%, 2.5V±10%; 1.8V±10%; TA = –40°C to +105°C, CLOAD = 2 pF unless
noted.
Parameter
Symbol
Min.
Typ.
Max.
Units Conditions



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