S6002xS

Thyristor Datasheet

6

Specifications are subject to change without notice.

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Revised: 5/6/2021

6. Soldering Parameters

Parameter

Value

Reflow Condition

Pb-free Assembly

Pre-Heat

150 °C

200 °C

60 to 180 s

5 °C/s (Max)

5 °C/s (Max)

Reflow

217 °C

60 to 150 s

260 °C (±5 °C)

20 to 40 s

Ramp-down Rate

5 °C/s (Max)

8 minutes (Max)

Do Not Exceed

280 °C

7. Physical Specifications

Device Feature

Detail

Terminal Finish

100% Matte Tin-plated

Body Material

UL Recognized Epoxy meeting Flammability

Rating 94 V-0

Terminal Material

Copper Alloy

8. Environmental Specifications

Test

Specifications and Conditions

AC Blocking

MIL-STD-750, M-1040, Cond A Applied Peak

AC voltage @ 110°C for 1008 hours

Temperature Cycling

MIL-STD-750, M-1051, 100 cycles; -40°C to

+150°C; 15 min dwell time

Temperature/Humidity

EIA / JEDEC, JESD22-A101 1008 hours;

320V - DC: 85°C; 85% relative humidity

High-temp Storage

MIL-STD-750, M-1031, 1008 hours; 150°C

Low-temp Storage

1008 hours; -40°C

Resistance to Solder

Heat

MIL-STD-750 Method 2031

Solderability

ANSI/J-STD-002, category 3, Test A

Lead Bend

MIL-STD-750, M-2036 Cond E

9. Design Considerations

Careful selection of the correct component for the

will go a long way toward extending the operating life

of the Thyristor. Good design practice should limit the

maximum continuous current through the main

terminals to 75% of the component rating. Other

ways to ensure long life for a power discrete

semiconductor are proper heat sinking and selection

of voltage ratings for worst case conditions.

Overheating, overvoltage (including dv/dt), and surge

currents are the main killers of semiconductors.

Correct mounting, soldering, and forming of the leads

also help protect against component damage.