5 Pin Configuration and Functions

1

D1

12

EN

2

S1B

11

VDD

3

VSS

10

S2B

4

GND

9

D2

Not to scale

Thermal

Pad

Figure 5-1. RUM Package, 16-Pin WQFN (Top View)

Table 5-1. Pin Functions

PIN

TYPE(1)

DESCRIPTION

NAME

NO.

D1

1

I/O

Drain pin. Can be an input or output.

D2

9

I/O

Drain pin. Can be an input or output.

GND

4

P

Ground (0 V) reference

NC

5, 7, 13, 14

—

No internal connection. Can be shorted to GND or left floating.

S1A

16

I/O

Source pin 1A. Can be an input or output.

S1B

2

I/O

Source pin 1B. Can be an input or output.

S2A

8

I/O

Source pin 2A. Can be an input or output.

S2B

10

I/O

Source pin 2B. Can be an input or output.

EN

12

I

Active high logic enable, has internal pull-up resistor. When this pin is low, all switches are turned off. When this pin

is high, the SEL logic input determine which switch is turned on.

SEL1

15

I

Logic control input, has internal pull-down resistor. Controls the switch connection as shown in Section 8.4.

SEL2

6

I

Logic control input, has internal pull-down resistor. Controls the switch connection as shown in Section 8.4.

11

P

Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a

3

P

Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin

can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF

Thermal Pad

—

The thermal pad is not connected internally. There is no requirement to electrically connect this pad. If connected,

however, it is recommended that the pad be left floating or tied to GND.

(1)

I = input, O = output, P = power

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TMUX7236

SCDS417 – MARCH 2022

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