2-472

RF3133

Rev A4 030527

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is

3

µinch to 8µinch Gold over 180µinch Nickel.

PCB Land Pattern Recommendation

PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and

tested for optimized assembly at RFMD; however, it may require some modifications to address company specific

assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.

PCB Metal Land and Solder Mask Pattern

Metal Land Pattern

0.00

0.80 (mm)

3.70 (mm)

1.50 (mm)

3.00 (mm)

4.50 (mm) Typ.

6.00 (mm)

7.50 (mm)

9.00 (mm) Typ.

5.30 (mm)

8.20 (mm)

8.30 (mm)

0.70 (mm)

A = 0.80 (mm) Sq. Typ.

B = 1.00 x 0.80 (mm) Typ.

Pin 1

AB

A

A

A

A

A

AA

A

B

B

Solder Mask Pattern

0.00

1.50 (mm) Typ.

3.00 (mm) Typ.

4.50 (mm) Typ.

6.00 (mm) Typ.

7.50 (mm) Typ.

9.00 (mm) Typ.

4.50 (mm)

Pin 1

0.05 (mm) Typ.

9.05 (mm) Typ.

B

C

D

E

E

E

E

D

D

A

B

BB

C

C

C

C

A

A

A

A

A

AA

A

F

A = 1.00 (mm) Sq. Typ.

B = 0.90 x 0.80 (mm) Typ.

C = 0.80 (mm) Sq. Typ.

D = 1.00 x 1.20 (mm) Typ.

E = 0.80 x 1.10 (mm) Typ.

F = 7.00 x 2.50 (mm) Typ.

Figure 1. PCB Metal Land and Solder Mask Pattern (Top View)