TLD4012 datasheet(11/13 Pages) TRIPATH

Part #	TLD4012

Description	ADSL LINE DRIVER USING TRIPATH DIGITAL POWER PROCESSING (DPP?? TECHNOLOGY

PDF	13 Pages

Scroll/Zoom	100%

Manufacturer	TRIPATH [Tripath Technology Inc.]

Direct Link	http://www.etelos.com/

Logo

11 / 13 page

Tr i p ath Technol ogy, I n c. - Techni cal I n for m ati on

TLD4012 – JB/Rev. 2.0a/05.02

APPLICATION INFORMATION

Power D i ssipation D e rating for 5x5mm TQFP with Exposed D i e Pad

For operating at ambient temperatures above 25

°C the device power dissipation, PDISS, must be de-rated

based on a 150

°C maximum junction temperature TJ (max) as given by the following equation:

PDISS = (TJ(max) – TA)/θJA

Where

θJA of the package is determined from the table, and TA is the ambient temperature.

θJA,C/W

(Copper Pad Soldered To PCB)

Airflow

(LFPM)

5x5mm

34.5

200

29.1

500

27.2

Values apply when the exposed pad is soldered to a JEDEC standard test board.

Note that PDISS is the power dissipated on the chip, not PCONS which is the power consumed from the

supplies.

The TLD4012 incorporates an exposed die pad on the underside of its package. This acts as a heat sink

and should be connected to a copper plane on the printed circuit board for optimum heat dissipation. This

copper plane must be connected to VSS15.

TLD4012 Datasheet(PDF) 11 Page - Tripath Technology Inc.