Rev Date: 7/22/2022

6

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This specification may be changed at any time without prior notice.

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Please confirm technical specifications before you order and/or use.

RMCF / RMCP Series

General Purpose Thick Film Standard Power

and High-Power Chip Resistor

Stackpole Electronics, Inc.

Resistive Product Solutions

Recommended Solder Profile

This information is intended as a reference for solder profiles for Stackpole resistive components. These profiles should

be compatible with most soldering processes. These are only recommendations. Actual numbers will depend on board

density, geometry, packages used, etc., especially those cells labeled with “*”.

100% Matte Tin / RoHS Compliant Terminations

Soldering iron recommended temperatures: 330°C to 350°C with minimum duration.

Maximum number of reflow cycles: 3.

Recommended Pad Layout

Wave Soldering

Description

Maximum

Recommended

Minimum

Preheat Time

80 seconds

70 seconds

60 seconds

Temperature Diff.

140°C

120°C

100°C

Solder Temp.

260°C

250°C

240°C

Dwell Time at Max.

10 seconds

5 seconds

*

Ramp DN (°C/sec)

N/A

N/A

N/A

Temperature Diff. = Defference between final preheat stage and soldering stage.

Type/Code

A

B

C

Unit

0.008

0.020

0.008

inches

0.20

0.50

0.20

mm

0.012

0.039

0.016

inches

0.30

1.00

0.40

mm

0.020

0.059

0.024

inches

0.50

1.50

0.60

mm

0.031

0.083

0.035

inches

0.80

2.10

0.90

mm

0.047

0.118

0.051

inches

1.20

3.00

1.30

mm

0.087

0.165

0.063

inches

2.20

4.20

1.60

mm

0.087

0.165

0.110

inches

2.20

4.20

2.80

mm

0.138

0.240

0.110

inches

3.50

6.10

2.80

mm

0.193

0.315

0.138

inches

4.90

8.00

3.50

mm

RMCF2512

RMCP2512

RMCF1210

RMCP1210

RMCF2010

RMCP2010

RMCF01005

RMCF0201

RMCP0201

RMCF0402

RMCP0402

RMCF0603

RMCP0603

RMCF0805

RMCP0805

RMCF1206

RMCP1206