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TC387 Datasheet(PDF) 7 Page - Infineon Technologies AG |
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TC387 Datasheet(HTML) 7 Page - Infineon Technologies AG |
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7 / 416 page ![]() TC38x AD/AE-Step Summary of Features Data Sheet 7 V 1.2, 2021-03 1 Summary of Features The TC38x product family has the following features: • High Performance Microcontroller with four CPU cores • Four 32-bit super-scalar TriCore CPUs (TC1.6.2P), each having the following features: – Superior real-time performance – Strong bit handling – Fully integrated DSP capabilities – Multiply-accumulate unit able to sustain 2 MAC operations per cycle – Fully pipelined Floating point unit (FPU) – up to 300 MHz operation at full temperature range – up to 240/96 Kbyte Data Scratch-Pad RAM (DSPR) – up to 64 Kbyte Instruction Scratch-Pad RAM (PSPR) – up to 64 Kbyte Data RAM (DLMU) – 32 Kbyte Instruction Cache (ICACHE) – 16 Kbyte Data Cache (DCACHE) • Lockstepped shadow cores for two TC1.6.2P • Multiple on-chip memories – All embedded NVM and SRAM are ECC protected – up to 10 Mbyte Program Flash Memory (PFLASH) – up to 512 Kbyte Data Flash Memory (DFLASH 0) usable for EEPROM emulation – 128 Kbyte Memory (LMU) – BootROM (BROM) • 128-Channel DMA Controller with safe data transfer • Sophisticated interrupt system (ECC protected) • High performance on-chip bus structure – 64-bit Cross Bar Interconnect (SRI) giving fast parallel access between bus masters, CPUs and memories – 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units – SRI to SPB bus bridges (SFI Bridge) • Optional Hardware Security Module (HSM) on some variants • Safety Management Unit (SMU) handling safety monitor alarms • Memory Test Unit with ECC, Memory Initialization and MBIST functions (MTU) • Hardware I/O Monitor (IOM) for checking of digital I/O • Versatile On-chip Peripheral Units – 24 Asynchronous/Synchronous Serial Channels (ASCLIN) with hardware LIN support (V1.3, V2.0, V2.1 and J2602) up to 50 MBaud – 5 Queued SPI Interface Channels (QSPI) with master and slave capability up to 50 Mbit/s – 1 High Speed Serial Link (HSSL) for serial inter-processor communication up to 320 Mbit/s – 3 serial Micro Second Bus interfaces (MSC) for serial port expansion to external power devices – 3 MCMCAN Modules with 4 CAN nodes for high efficiency data handling via FIFO buffering – 25 Single Edge Nibble Transmission (SENT) channels for connection to sensors –2 FlexRayTM module with 2 channels (E-Ray) supporting V2.1 OPEN MARKET VERSION |
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