- 3 -

Ver.6

http://www.njr.com/

NJU77240/NJU77241/NJU77242

■ THERMAL CHARACTERISTICS

PARAMETER

SYMBOL

VALUE

UNIT

Junction-to-Ambient Thermal Resistance

SOT-23-5

(7)

SC-88A

(7)

DFN6-G1

(8)

MSOP8 (TVSP8)

(7)

DFN8-U1

(8)

θja

2-Layer / 4-Layer

259 / 193

352 / 256

381 / 106

244 / 185

278 / 107

°C /W

Junction-to-Top of Package Characterization Parameter

SOT-23-5

(7)

SC-88A

(7)

DFN6-G1

(8)

MSOP8 (TVSP8)

(7)

DFN8-U1

(8)

ψjt

2-Layer / 4-Layer

67 / 58

91 / 73

64 / 26

51 / 45

42 / 25

°C /W

(7) 2-Layer:Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2-layer FR-4)

4-Layer:Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4-layer FR-4), internal Cu area: 74.2 x 74.2mm

(8) 2-Layer:Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 2-layer FR-4, with Exposed Pad)

4-Layer:Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 4-layer FR-4, with Exposed Pad)

*For 4-Layer: Applying 99.5×99.5mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5)

■ POWER DISSIPATION vs. AMBIENT TEMPERATURE

■ RECOMMENDED OPERATING CONDITIONS

PARAMETER

SYMBOL

VALUE

UNIT

Supply Voltage

Single Supply

Dual Supply

V

+- V-

V

+ / V-

1.8 to 5.5

±0.9 to ±2.75

V

Operating Temperature Range

Topr

- 40 to 125

°C

Output Terminal Input Voltage

Vo

V

- to V-+5.5

V

0

100

200

300

400

500

600

700

0

25

50

75

100

125

150

Ambient Temperature Ta [ºC]

Power Dissipation vs. Temperature

2-Layer

SOT-23-5

SC-88A

DFN6-G1(ESON6-G1)

MSOP8(TVSP8)

DFN8-U1(ESON8-U1)

0

200

400

600

800

1000

1200

1400

0

25

50

75

100

125

150

Ambient Temperature Ta [ºC]

Power Dissipation vs. Temperature

4-Layer

SOT-23-5

SC-88A

DFN6-G1(ESON6-G1)

DFN8-U1(ESON8-U1)

MSOP8(TVSP8)