7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

0

6

V

Signal input pins

Common mode voltage(2)

(V–) – 0.5

(V+) + 0.5

V

Differential voltage(3)

VS + 0.2

V

Current(2)

–10

10

mA

Output short-circuit(4)

Continuous

Operating Temperature, TA

–55

150

°C

Junction Temperature, TJ

150

Storage Temperature, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less

(3)

Differential input voltages greater than 0.5 V applied continuously can result in a shift to the input offset voltage above the maximum

specification of this parameter. The magnitude of this effect increases as the ambient operating temperature rises.

(4)

Short-circuit to VS / 2.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage VS = (V+) – (V–)

Single-supply

1.8

5.5

V

Dual-supply

±0.9

±2.75

Input Voltage Range

(V–)

(V+)

V

Specified temperature

Specified temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

INA351ABS, INA351CDS

UNIT

DDF (SOT-23-THN)

DSG (WSON)

RUG (X2QFN)

8 PINS

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

172.1

80.3

174.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

90.1

100.4

63.2

°C/W

RθJB

Junction-to-board thermal resistance

88.2

46.4

99.6

°C/W

ψJT

Junction-to-top characterization parameter

7.3

5.3

1.3

°C/W

ψJB

Junction-to-board characterization parameter

88.0

46.4

99.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

21.9

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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INA351

SBOSAD5 – DECEMBER 2022

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