6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC-ABSMAX

Supply voltage

–0.5

4.0

V

VI/O-ABSMAX

Voltage

Data pins

–0.5

5.5

V

VIN-ABSMAX

Voltage

Control pins

–0.5

4.0

V

II/O-ABSMAX

ON-state switch current

Data pins

100

mA

TJ-ABSMAX

Junction temperature

–40

125

°C

TSTG

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

VESD

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±5000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VCC

Supply voltage

DC plus AC power should not

exceed these limits

3.0

3.3

3.6

V

VCCRAMP

Supply voltage ramp time

0.1

100

ms

VI/O

Voltage range for data signals (VI/O)

D, DA, DB

-0.3

3.6

V

TA

Operating free-air/ambient temperature

-40

125

°C

TJ

Device junction temperature

-40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMUXHS221

UNIT

NKG (UQFN)

10 PINS

RθJA

Junction-to-ambient thermal resistance - High K

225.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

93.5

°C/W

RθJB

Junction-to-board thermal resistance

147.5

°C/W

ψJT

Junction-to-top characterization parameter

3.4

°C/W

ψJB

Junction-to-board characterization parameter

147.1

°C/W

(1)

For more information about traditional and new thermalmetrics, see the Semiconductor and IC Package ThermalMetrics application

report.

TMUXHS221

SLASF52A – AUGUST 2022 – REVISED NOVEMBER 2022

www.ti.com

4

Submit Document Feedback

Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TMUXHS221