TLK2521

1 to 2.5 Gbps TRANSCEIVER

SLLS574B − JULY 2003 − REVISED JANUARY 2004

10

POST OFFICE BOX 655303

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

POWER RATING

DERATING FACTOR†

ABOVE TA = 25°C

TA = 70°C

POWER RATING

PAP64‡

3.22 W

32.15 mW/

°C

1.77 W

PAP64§

0.94 W

9.46 mW/

°C

0.52 W

PAP64¶

0.68 W

6.78 mW/

°C

0.37 W

† This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA)

‡ High K-board with solder

§ High K-board without solder

¶ Low K-board

NOTE: For more information, see the TI application note PowerPAD

 Thermally Enhanced Package, TI (SLMA002).

electrical characteristics over recommended operating conditions

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

VDD

Supply voltage

2.3

2.5

2.7

V

TA

Operating free-air temperature

−40

85

°C

ICC

Supply current

VDD = 2.5 V, Freq = 1 Gb/sec, PRBS pattern

71

mA

ICC

Supply current

VDD = 2.5 V, Freq = 2.5 Gb/sec, PRBS pattern

170

mA

VDD = 2.5 V, Freq = 1 Gb/sec, PRBS pattern

178

PD

Power dissipation

VDD = 2.5 V, Freq = 2.5 Gb/sec, PRBS pattern

424

mW

PD

Power dissipation

VDD = 2.75 V, Freq = 2.5 Gb/sec, worst case pattern

730

mW

Shutdown current

ENABLE = 0, VDDA, VDD pins, VDD = max

130

µA

PLL startup lock time

VDD, VDDA = 2.3 V, EN ↑ to PLL acquire

0.1

0.4

ms

Data acquisition time

1024

bits

reference clock (GTX_CLK) timing requirements over recommended operating conditions (unless

otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

R

Frequency

Minimum data rate

TYP−0.01%

50

TYP+0.01%

MHz

Rω

Frequency

Maximum data rate

TYP−0.01%

125

TYP+0.01%

MHz

Frequency tolerance

−100

100

ppm

Duty cycle

40%

50%

60%

Jitter#

Peak-to-peak

40

ps

# See the Reference Lock Jitter Analysis For TLK2521 application note for more information.