TLK2521

1 to 2.5 Gbps TRANSCEIVER

SLLS574B − JULY 2003 − REVISED JANUARY 2004

17

POST OFFICE BOX 655303

Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD



Thermally Enhanced Package application report, TI (SLMA002), available via the TI Web pages beginning at

URL: http://www.ti.com.

Figure 13. Example of a Thermal Land

For the TLK2521, this thermal land should be grounded to the low-impedance ground plane of the device. This

improves not only thermal performance but also the electrical grounding of the device. It is also recommended

that the device ground pin landing pads be connected directly to the grounded thermal land. The land size

should be as large as possible without shorting device signal pins. The thermal land may be soldered to the

exposed PowerPAD using standard reflow soldering techniques.

While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is

recommended that the thermal land be connected to the low impedance ground plane for the device. More

information may be obtained from the TI application note PHY Layout, TI (SLLA020).