TSPC603R datasheet(2/58 Pages) ATMEL

2 / 58 page

5410B–HIREL–09/05

TSPC603R

The 603R uses an advanced, 2.5/3.3V CMOS process technology and maintains full interface

compatibility with TTL devices. It also integrates in-system testability and debugging features

through JTAG boundary-scan capabilities.

Screening/Quality/Packaging

This product is manufactured in full compliance with:

• HiTCE CBGA according to Atmel Standards

• CI-CGA 255 and Cerquad: MIL-PRF-38535 class Q or according to Atmel standards

• CBGA 255: Upscreenings based upon Atmel standards

• CBGA, CI-CGA, HiTCE packages:

– Full military temperature range (T

C = -55°C, Tj = +125°C)

– Industrial temperature range

C = -40°C, Tj = +110°C)

• Cerquad:

– Full military temperature range (T

C = -55°C, Tc = +125°C)

– Industrial temperature range

C = -40°C, Tc = +110°C)

– Commercial temperature ranges (T

C = 0°C, TC = +70°C)

• Internal I/O Power Supply = 2.5 ±5% // 3.3V ±5%

G suffix

CBGA 255

Ceramic Ball Grid Array

GS suffix

CI-CGA 255

Ceramic Ball Grid Array

with Solder Column Interposer (SCI)

CERQUAD 240

GH suffix

HiTCE 255

Ceramic Ball Grid Array

A suffix

CERQUAD 240

Ceramic Leaded Chip Carrier

Cavity up

TSPC603R Datasheet(PDF) 2 Page - ATMEL Corporation