MPC855T datasheet(10/77 Pages) NXP

10 / 77 page

MPC860 PowerQUICC Family Hardware Specifications, Rev. 10

Freescale Semiconductor

Power Dissipation

Table 5 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal,

and 2:1, where CPU frequency is twice the bus speed.

NOTE

Values in Table 5 represent VDDL-based power dissipation and do not

include I/O power dissipation over VDDH. I/O power dissipation varies

widely by application due to buffer current, depending on external circuitry.

DC Characteristics

Table 6 provides the DC electrical characteristics for the MPC860.

Table 5. Power Dissipation (PD)

Die Revision

Frequency (MHz)

Typical 1

1 Typical power dissipation is measured at 3.3 V.

Maximum 2

2 Maximum power dissipation is measured at 3.5 V.

Unit

D.4

(1:1 mode)

656

735

TBD

D.4

(2:1 mode)

722

762

851

909

Table 6. DC Electrical Specifications

Characteristic

Symbol

Min

Max

Unit

Operating voltage at 40 MHz or less

VDDH, VDDL, VDDSYN

3.0

3.6

KAPWR

(power-down mode)

2.0

3.6

KAPWR

(all other operating modes)

VDDH – 0.4

VDDH

Operating voltage greater than 40 MHz

VDDH, VDDL, KAPWR,

VDDSYN

3.135

3.465

KAPWR

(power-down mode)

2.0

3.6

KAPWR

(all other operating modes)

VDDH – 0.4

VDDH

Input high voltage (all inputs except EXTAL and

EXTCLK)

VIH

2.0

5.5

Input low voltage1

VIL

GND

0.8

EXTAL, EXTCLK input high voltage

VIHC

0.7

× (V

DDH)VDDH + 0.3

Input leakage current, Vin = 5.5 V (except TMS, TRST,

DSCK, and DSDI pins)

Iin

—100

µA

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