AP22916

Document number: DS44758 Rev. 1 - 2

29 of 32

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March 2022

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AP22916

Application Information

Input Capacitor

A 1μF capacitor is recommended to connect between the VIN and GND pins to decouple input power supply glitch and noise. The input capacitor

has no specific type or ESR (equivalent series resistance) requirement. However, for higher current applications, ceramic capacitors are

recommended due to their capability to withstand input current surges from low impedance sources, such as batteries in portable applications. This

input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper trace is

required for both VIN and GND.

Output Capacitor

A 0.1μF to 1μF capacitor is recommended to connect between the VOUT and GND pins to stabilize and accommodate load transient condition. The

output capacitor has no specific type or ESR requirement. The amount of capacitance may be increased without limit. For PCB layout, the output

capacitor must be placed as close as possible to the VOUT and GND pins, and the traces must be kept as short as possible.

Enable/Shutdown Operation

The AP22916B/C is turned on by setting the ON pin high, and is turned off by pulling it low. To ensure proper operation, the signal source used to

drive the ON pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section

under VIL and VIH.

True Reverse Current Blocking

An internal reverse voltage comparator disables the power-switch when the output voltage (VOUT) is driven higher than the input voltage (VIN), by

VRCB, to quickly (10μs typ.) stop the flow of current towards the input side of the switch.

Reverse current protection is always active, even when the power switch is disabled. Additionally, undervoltage lockout (UVLO) protection turns the

switch off if the input voltage is too low.

Discharge Operation

The AP22916/C offers a discharge option that helps to discharge the output charge when disabled.

Power Dissipation

The maximum IC junction temperature should be restricted to +125°C under normal operating conditions. The device power dissipation and proper

sizing of the thermal plane are critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input

voltage and load conditions, and can be calculated by:

DSON

2

OUT

D

xR

I

P



(1)

However, the maximum power dissipation that can be handled by the device depends on the maximum junction to ambient thermal resistance,

maximum ambient temperature, and maximum device junction temperature, which can be approximated by the equation below:

JA

A

)

MAX

(

D

)

T

C

125

(

P









(2)

Layout Guideline

Good PCB layout is important for improving the thermal performance of the device. All trace lengths should be kept as short as possible. The input

(VIN) and output (VOUT) PCB traces should be as wide as possible to reduce stray impedance.

Use a ground plane to enhance the power dissipation capability of the device if applicable. Place input and output capacitors close to the device to

minimize the effects of parasitic inductance.