ZSSC4151C Datasheet

© 2022 Renesas Electronics Corporation

23

March 25, 2020

Table 9.

Dimensioning of External Components for the Application Example

Note: The component values given here are examples and must be adapted to the requirements of the application, in particular to the EMC

requirements.

Requirement

Component

Symbol

Conditions

Min

Typical

Max

Unit

Informational

Capacitor

C1

VMAX ≥ 60V

Low ESR type

100

1000 + 20%

nF

Informational

Capacitor

C2

VMAX ≥ 10V

Low ESR type

47 – 20%

100

220 + 20%

nF

Informational

Capacitor

CLOAD

VMAX ≥ 60V

Low ESR type

4.7 – 20%

47

100 + 20%

nF

10. ESD Protection and EMC Specification

The level of ESD protection and EMC specifications are tested with devices in 24-QFN 4mm x 4mm packages during the product qualification.

10.1 ESD Protection

All pins have an ESD protection of ≥ 2000V according to the Human Body Model (HBM with 1.5kΩ/100pF, based on MIL883, Method 3015.7).

The VDDE, VSSE, and AOUT pins have an additional ESD protection of ≥ 4000V (HBM with 1.5kΩ/100pF, based on MIL883, Method 3015.7).

In addition, Charged Device Model (CDM) tests are processed with protection levels of ≥ 750V for corner pins and ≥ 500V for all other pins.

10.2 Latch-Up Immunity

All pins pass Renesas’s ±100mA latch-up test based on testing that conforms to the standard EIA/JESD 78.

10.3 Electromagnetic Emission

The wired emission of externally connected pins of the device is measured according to the following standard: IEC 61967_4:2002 + A1:2006.

Measurements must be performed with the application circuits described in section 9.

For the off-board pins, the spectral power measured with the 150Ω method must not exceed the limits according to IEC 61967_4k, Annex B.4

code H10kN. For the VSSE pin, the spectral power measured with the 1Ω method must not exceed the limits according to IEC 61967_4k,

Annex B.4 code 15KmO.