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DP83231 Datasheet(PDF) 11 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # DP83231
Description  CRD Device (FDDI Clock Recovery Device)
PDF  16 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

DP83231 Datasheet(HTML) 11 Page - National Semiconductor (TI)

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50 Detailed Information
51 SPECIAL EXTERNAL COMPONENTS
Crystals
 Manufacturer Nel Frequency Controls (414) 763-3591
Part
C5400N
 Manufacturer Standard Crystal Corporation
(818) 443-2121
Part
800R-A-1041667-32
Key Specifications
Center Frequency
1041667 MHz
Load Capacitance CL 32 pF
Frequency Calibration g20 PPM
Frequency Stability
(0 C–70 C)
g
20 PPM
Aging
k g
10 PPM
Pullability
either
a
motional
capacitance
of
t
0021
or
a change of at least 100 PPM when
the CL is changed from 32 pF to 18 pF
and a change of b100 PPM when the
CL is changed from 32 pF to 50 pF
Varactors
 Manufacturer Alpha Industries (617) 935-5150
Part
DKV6510-71
Key Specifications
Capacitance
Vr e 1V C l 85 pF
Vr e 4V 15 pF k C k 30 pF
52 LAYOUT RECOMMENDATIONS
 The part should be bypassed between the EXTVCC and
EXTGND as close to the chip as possible (preferably under
the chip using chip caps) The part should also be bypassed
between the DVCC and DGND and the AVCC and AGND as
close to the chip as possible
 No TTL logic lines should pass through the crystal OSC
FLTRs or VCO FLTR circuitry areas to avoid the possibility
of noise due to crosstalk
 The crystal OSC FLTRs and the VCO FLTR circuitries
should be connected to Ground on isolated branches off of
the DGND pin If using a multilayered board with dedicated
VCC and Ground planes ensure that for the ground plane
that the ceramic resonator OSC FLTRs and the VCO FLTR
circuitries have their own small isolated islands that are con-
nected to the DGND and AGND pins as described above
 The DVCC and AVCC pins should be connected to VCC on
an isolated branches off of the EXTVCC pin preferably be-
ing connected through a ferrite bead or a small inductor
 The DGND and AGND pins should be connected to GND
on an isolated branches off of the EXTGND pin Connection
to the ground plane should be made only at the EXTGND
pin
TLF10384 – 10
This drawing was done with convenience in mind
FIGURE 5-1 Recommended Layout
11



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