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BLF245 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BLF245 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 12 page ![]() September 1992 3 Philips Semiconductors Product specification VHF power MOS transistor BLF245 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). THERMAL RESISTANCE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage VGS =0 − 65 V ±VGS gate-source voltage VDS =0 − 20 V ID DC drain current − 6A Ptot total power dissipation up to Tmb = 25 °C − 68 W Tstg storage temperature −65 150 °C Tj junction temperature − 200 °C SYMBOL PARAMETER CONDITIONS THERMAL RESISTANCE Rth j-mb thermal resistance from junction to mounting base Tmb =25 °C; Ptot = 68 W 2.6 K/W Rth mb-h thermal resistance from mounting base to heatsink Tmb =25 °C; Ptot = 68 W 0.3 K/W Fig.2 DC SOAR. (1) Current is this area may be limited by RDS(on). (2) Tmb =25 °C. handbook, halfpage 10−1 102 1 10 110 ID (A) VDS (V) (1) MRA921 (2) Fig.3 Power/temperature derating curves. (1) Continuous operation. (2) Short-time operation during mismatch. handbook, halfpage 0 40 80 160 100 80 40 20 0 60 120 MGP167 Ptot (W) Th (°C) (1) (2) |
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