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BLF276 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BLF276 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 13 page ![]() December 1997 3 Philips Semiconductors Product specification VHF power MOS transistor BLF276 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). THERMAL RESISTANCE SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-source voltage − 110 V ±VGS gate-source voltage − 20 V ID DC drain current − 9A Ptot total power dissipation up to Tmb = 25 °C − 150 W Tstg storage temperature −65 150 °C Tj junction temperature − 200 °C SYMBOL PARAMETER CONDITIONS THERMAL RESISTANCE Rth j-mb thermal resistance from junction to mounting base Ptot = 150 W; Tmb =25 °C max. 1.17 K/W Fig.2 DC SOAR. (1) Current is this area may be limited by RDS(on). (2) Tmb = 25 °C. handbook, halfpage 10−1 1 ID (A) 10 110 VDS (V) 102 103 (1) MRA936 (2) Fig.3 Power/temperature derating curves. (1) Continuous operation. (2) Short-time operation during mismatch. handbook, halfpage 0 40 80 120 160 200 240 020 Ptot (W) 40 60 80 100 Tmb (°C) 120 140 (1) (2) MRA943 |
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