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BLV57 Datasheet(PDF) 17 Page - NXP Semiconductors |
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BLV57 Datasheet(HTML) 17 Page - NXP Semiconductors |
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17 / 24 page ![]() 1998 Feb 09 17 Philips Semiconductors Product specification UHF linear push-pull power transistor BLV57 The circuit and the components are on one side of the PTFE fibre-glass board, the other side is unetched copper to serve as a ground-plane. Earth connections are made by means of bolts. Additionally copper straps are used under the emitters and at the input and output to provide direct contact between the copper on the component side and the ground-plane. Fig.17 Component layout and printed-circuit board for 860 MHz class-AB test circuit. handbook, full pagewidth 60 11 64 73 +V BB1 +V CC1 +V CC2 +V BB2 input C14 C11 C8 C5 L1 L2 C1 C3 C2 L5 L3 C4 C9 L6 L7 L11 L10 L12 L9 C13 C15 C17 C18 C20 C19 C16 C12 C10 C7 L8 L4 C6 C21 L14 L13 R1 L10 L11 output MGP373 11 |
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