AD8382 datasheet(19/24 Pages) AD

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AD8382

AD8382 PCB DESIGN RECOMMENDATIONS

Land pattern Dimensions

Pad Size:

0.5 mm × 0.25 mm

Pad Pitch:

0.5 mm

Thermal Pad Size:

5.25 mm × 5.25 mm

Thermal via structure:

0.25 mm diameter.

Vias on 0.5mm grid.

7mm

LAND PATTERN – TOP LAYER

Figure 46. Land Pattern—Top Layer

THERMAL PAD AND VIA CONNECTIONS

Thermal Pads are connected to AVCC.

For PCBs with the AVCC

plane located on one of

the outer layers, direct

connection of at least one

thermal pad to the AVCC

plane is recommended.

For PCBs with the AVCC

plane located on one of

the internal layers, direct

connection of all thermal

vias to the AVCC plane is

recommended.

LAND PATTERN – BOTTOM LAYER

Figure 47. Land Pattern—Bottom Layer

The use of thermal spokes is not recommended when

connecting the thermal pads or via structure to the AVCC

plane.

SOLDER MASKING

To minimize the formation of solder voids due to solder flowing

into the via holes (solder wicking), via diameter should be small.

Solder masking of the via holes on the top layer of the PCB

plugs the via holes, inhibiting solder flow into the holes. To

optimize the thermal pad coverage, the solder mask diameter

should be no more than 0.1 mm larger than the via diameter.

Solder Mask—Top Layer

Pads: Set by customer’s PCB

Design Rules

Thermal Vias: 0.25 mm dia.

circular mask, centered on the

vias.

Solder Mask—Bottom

Layer

Set by customer’s PCB Design

Rules.

SOLDER MASK – TOP LAYER

Figure 48. Solder Mask—Top Layer

Rev. 0 | Page 19 of 24

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