6.4 Thermal Information

THERMAL METRIC(1)

TLV709 (2)

UNIT

DBV

[SOT-23]

PK

[SOT-89]

5 PINS

4 PINS

RθJA

Junction-to-ambient thermal resistance

195.7

131.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

88.2

65.8

°C/W

RθJB

Junction-to-board thermal resistance

40.7

32.4

°C/W

ψJT

Junction-to-top characterization parameter

11.2

69.8

°C/W

ψJB

Junction-to-board characterization parameter

40.5

96.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

(2)

Thermal performance results are based on the JEDEC standard of 2s2p PCB configuration. These thermal metric parameters can be

further improved by 35-55% based on thermally optimized PCB layout designs. See the analysis of the Impact of board layout on LDO

thermal performance application report.

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TLV709

SLVSGU2B – FEBRUARY 2023 – REVISED JUNE 2023

Copyright © 2023 Texas Instruments Incorporated

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