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MCP98244 Datasheet(PDF) 46 Page - Microchip Technology

Part # MCP98244
Description  DDR4 DIMM Temperature Sensor with EEPROM for SPD
PDF  52 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP98244 Datasheet(HTML) 46 Page - Microchip Technology

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MCP98244
DS20002327D-page 46
 2012-2022 Microchip Technology Inc. and its subsidiaries
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.50
1.60
MILLIMETERS
0.50 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.85
0.25
Microchip Technology Drawing No. C04-129-MN Rev. B
NOM
8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
12
8
C
Contact Pad Spacing
2.90
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C
E
X1
Y1
Y2
X2
EV
EV
ØV
SILK SCREEN
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)



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