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MCP98244 Datasheet(PDF) 8 Page - Microchip Technology

Part # MCP98244
Description  DDR4 DIMM Temperature Sensor with EEPROM for SPD
PDF  52 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP98244 Datasheet(HTML) 8 Page - Microchip Technology

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MCP98244
DS20002327D-page 8
 2012-2022 Microchip Technology Inc. and its subsidiaries
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLES
3.1
Address Pins (A0, A1, A2)
These pins are device address input pins.
The address pins correspond to the Least Significant
bits (LSb) of address bits. The Most Significant bits
(MSb) are (A6, A5, A4, A3). This is shown in Table 3-2.
The A0 Address pin is a multi-function pin. This input
pin is also used for high voltage input VHV to enable the
EEPROM Software Write Protect feature, for more
information see Section 5.3.3 “Bank or page selec-
tion for EEPROM Read/write operation”.
All address pin have an internal pull-down resistors.
3.2
Ground Pin (GND)
The GND pin is the system ground pin.
3.3
Serial Data Line (SDA)
SDA is a bidirectional input/output pin, used to serially
transmit data to/from the host controller. This pin
requires a pull-up resistor. (See Section 4.0 “Serial
Communication”).
3.4
Serial Clock Line (SCL)
The SCL is a clock input pin. All communication timing
is relative to the signal on this pin. The clock is gener-
ated by the host or host controller on the bus. (See
Section 4.0 “Serial Communication”).
3.5
Temperature Alert, Open-Drain
Output (Event)
The MCP98244 temperature Event output pin is an
open-drain output. The device outputs a signal when
the ambient temperature goes beyond the user-pro-
grammed temperature limit. (see Section 5.2.3 “Event
Output Configuration”).
3.6
Power Pin (VDD)
VDD is the power pin. The operating voltage range, as
specified in the DC electrical specification table, is
applied on this pin.
3.7
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the GND pin; they can
be connected to the same potential on the Printed
Circuit Board (PCB). This provides better thermal
conduction from the PCB to the die.
MCP98244
Symbol
Description
TDFN
1
A0
Client Address and EEPROM Software Write Protect High Voltage Input (VHV)
2
A1
Client Address
3
A2
Client Address
4
GND
Ground
5
SDA
Serial Data Line
6
SCL
Serial Clock Line
7
Event
Temperature Alert Output
8VDD
Power Pin
9
EP
Exposed Thermal Pad (EP); can be connected to GND.
TABLE 3-2:
MCP98244 ADDRESS BYTE
Device
Address Code
Client
Address
A6 A5 A4 A3 A2 A1 A0
Sensor
00
11
X1
X1
X1
EEPROM
10
10
EEPROM
Write Protect
01
10
—2 —2 —2
Note 1: User-selectable address is shown by X,
where X is 1 or 0 for VDD and GND,
respectively.
2: The address pins are ignored for all Write
Protect commands.



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