UPD17708 datasheet(352/358 Pages) RENESAS

352 / 358 page

350

µPD17704, 17705, 17707, 17708, 17709

26. RECOMMENDED SOLDERING CONDITIONS

Solder the

µPD17709 under the following recommended conditions.

For the details of the recommended soldering conditions, refer to “Semiconductor Device Mounting Technology

Manual” (C10535E).

For the soldering method and conditions other than those recommended, consult NEC.

Table 26-1. Soldering Conditions of Surface Mount Type

µPD17704GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

µPD17705GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

µPD17707GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

µPD17708GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

µPD17709GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)

Symbol of

Soldering Method

Soldering Condition

Recommended

Condition

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds MAX. (210 °C MIN.)

IR35-00-2

Number of times: 2 MAX.

VPS

Package peak temperature: 215

°C, Time: 40 seconds MAX. (200 °C MIN.)

VP15-00-2

Number of times: 2 MAX.

Wave soldering

Soldering bath temperature: 260

°C MAX., Time: 10 seconds MAX., Number of times: 1, WS60-00-1

Preheating temperature: 120

°C MAX. (package surface temperature)

Partial heating

Pin temperature: 300

°C MAX., Time: 3 seconds MAX. (per side of device)

—

Caution Do not use two or more soldering methods in combination (except partial heating method).

UPD17708 Datasheet(PDF) 352 Page - Renesas Technology Corp