6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD, VDD_R

Power supply voltage

−0.3

3.6

V

VIN

IO input voltage

−0.3

3.6

V

TJ

Junction temperature

125

°C

Tstg

Storage temperature

−65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC

JS-001, all pins(1)

±3500

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD

IO, Core supply voltage

3

3.3

3.6

V

VDD_R

Input supply voltage

3

3.3

3.6

V

TA

Ambient temperature

−40

105

°C

6.4 Thermal Information

THERMAL METRIC(1)

Device Package

UNIT

RSL (QFN)

48 PINS

RθJA

Junction-to-ambient thermal resistance

32.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

22.3

°C/W

RθJB

Junction-to-board thermal resistance

14.3

°C/W

ΨJT

Junction-to-top characterization parameter

0.5

°C/W

ΨJB

Junction-to-board characterization parameter

14.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

6.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

CDCDB803

SNAS820A – AUGUST 2021 – REVISED MAY 2022

www.ti.com

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