Analog Integrated Circuit Device Data

4

Freescale Semiconductor

33996

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

ELECTRICAL RATINGS

VPWR Supply Voltage (1)

-1.5 to 50

V

SO Output Driver Power Supply Voltage (1)

-0.3 to 7.0

V

SPI Interface Logic Input Voltage (CS, PWM, SI, SO, SCLK, RST) (1)

-0.3 to 7.0

V

Output Drain Voltage

-0.3 to 45

V

Frequency of SPI Operation (2)

6.0

MHz

Output Clamp Energy (3)

50

mJ

ESD Voltage (4)

Human Body Model

Machine Model

±2000

±200

V

THERMAL RATINGS

Operating Temperature

Ambient

Junction

Case

-40 to 125

-40 to 150

-40 to 125

Storage Temperature

-55 to 150

(5)

1.7

W

Peak Package Reflow Temperature During Reflow (6), (7)

Note 7

°C

Thermal Resistance

Junction-to-Ambient (8)

Junction- to-Lead (9)

Junction-to-Flag

75

8.0

1.2

°C/W

Notes

1.

Exceeding these limits may cause malfunction or permanent damage to the device.

2.

This parameter is guaranteed by design but not production tested.

3.

Maximum output clamp energy capability at 150

°C junction temperature using single nonrepetitive pulse method.

4.

Ω) and the Machine Model (C

5.

Maximum power dissipation with no heat sink used.

6.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

7.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

8.

Tested per JEDEC test JESD52-2 (single-layer PWB).

9.

Tested per JEDEC test JESD51-8 (two-layer PWB).