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33887 Datasheet(PDF) 26 Page - Freescale Semiconductor, Inc

Part # 33887
Description  5.0 A H-Bridge with Load Current Feedback
PDF  37 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

33887 Datasheet(HTML) 26 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
26
Freescale Semiconductor
33887
PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
The 33887 packages are designed for thermal
performance. The significant feature of these packages is the
exposed pad on which the power die is soldered. When
soldered to a PCB, this pad provides a path for heat flow to
the ambient environment. The more copper area and
thickness on the PCB, the better the power dissipation and
transient behavior will be.
Example Characterization on a double-sided PCB:
bottom side area of copper is 7.8 cm2; top surface is 2.7 cm2
(see Figure ); grid array of 24 vias 0.3 mm in diameter
.
Figure 24. PCB Test Layout
Top Side
Bottom Side



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