33887 datasheet(34/37 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33887

ADDITIONAL DOCUMENTATION

THERMAL ADDENDUM (REV 2.0)

Figure 26. Thermal Test Board

Device on Thermal Test Board

RθJA is the thermal resistance between die junction and

ambient air.

RθJS is the thermal resistance between die junction and the

reference location on the board surface near a center lead of the

package (see Figure 26).

AGND

IN2

CCP

V+

OUT2

PGND

V+

OUT1

PGND

IN1

V+

Tab

33887 Pin Connections

20-Pin HSOP-EP

1.27 mm Pitch

16.0 mm x 11.0 mm Body

12.2 mm x 6.9 mm Exposed Pad

Material:

Single layer printed circuit board

FR4, 1.6 mm thickness

Cu traces, 0.07 mm thickness

Outline:

80 mm x 100 mm board area,

including edge connector for thermal

testing

Area A:

Cu heat spreading areas on board

surface

Ambient Conditions:

Natural convection, still air

Table 8.

Thermal Resistance Performance

Thermal Resistance

Area A (mm2)

°C/W

RθJA

0.0

300

600

RθJS

0.0

300

7.0

600

6.0

33887 Datasheet(PDF) 34 Page - Freescale Semiconductor, Inc

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