Description:

Peripheral Imaging Corporation PI3039 CIS (Contact Image Sensor) sensor chip is a linear

array image sensor chip with a 600 elements per inch resolution. The sensor chip is fabricated

with PIC’s proprietary CMOS Image Sensing Technology. Since this image sensor chip is

intended for CIS module applications, multiple numbers of these sensors will be serially

cascaded to form a linear scanning image array of arbitrary length. These sensors are butted

end-to-end on a printed circuit board (PCB). The sensors are mounted using the chip-on-

board technology to form scanning arrays with various lengths

Figure 1. PI3039 Sensor Block Diagram

Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 192 detector elements,

their associated multiplexing switches, buffer amplifiers, and a chip selector. The detector's element-

to-element spacing is approximately 42µm. The size of each chip without the scribe lines is 8080 µm

by 360 µm. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in

Table 1.

Engineering Data Sheet

Peripheral

Imaging

Corporation

™

600DPI CIS Image Sensor Chip

PI3039

Page 1 of 10, PI3039, 12/2/02

1

2

3

4

189

190

191

192

8080 µm

360 µm

BUFFER

BUFFER

BUFFER

CHIP

SELECT

READ OUT SHIFT REGISTER

ROW OF 192 SENSORS

AND VIDEO SIGNAL

LINE MULTIPLEXER

SP

CP

VDD

VSS

IOUT

EOS