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PI3041A Datasheet(PDF) 3 Page - AMI SEMICONDUCTOR |
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PI3041A Datasheet(HTML) 3 Page - AMI SEMICONDUCTOR |
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3 / 18 page ![]() Preliminary PI3041A datasheet Bonding Pad Outputs Locations and Die Dimensions Figure 2 shows image sensor’s die dimension and the bonding pad locations for PI3041A Sensor Chip. The location is referenced to the lower left corner of the die. Figure 2. Bonding Pad and Chip Layout: Page 3 of 18 Date: 09/23/05 |
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