Data Sheet

AD532

Rev. E | Page 5 of 14

THERMAL RESISTANCE

θJA is specified for the worst case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 2. Thermal Resistance

Package Type

θJA

θJC

Unit

H-10A

150

25

°C/W

D-14

85

22

°C/W

CHIP DIMENSIONS AND BONDING DIAGRAM

Contact factory for the latest dimensions. Dimensions are

shown in inches and (millimeters).

0.062

(1.575)

GND

Z

0.107

(2.718)

–VS

+VS

Y1

Y2

X2

X1

VOS

OUTPUT

Figure 2.

ESD CAUTION