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MICRF213 Datasheet(PDF) 7 Page - Micrel Semiconductor |
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MICRF213 Datasheet(HTML) 7 Page - Micrel Semiconductor |
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7 / 16 page ![]() Micrel, Inc. MICRF213 May 2007 7 M9999-052307-A (408) 944-0800 Detector and Programmable Low-Pass Filter The demodulation starts with the detector removing the carrier from the IF signal. Post detection, the signal becomes base band information. The programmable low-pass filter further enhances the base band information. There are four programmable low-pass filter BW settings: 1180Hz, 2360Hz, 4270Hz, 9400Hz for 315MHz operation. Low pass filter BW will vary with RF Operating Frequency. Filter BW values can be easily calculated by direct scaling. See the equation below for the filter BW calculation: BWOperating Freq = BW@315MHz × ⎟ ⎠ ⎞ ⎜ ⎝ ⎛ 315 (MHz) Freq Operating It is very important to choose filter setting that best fits the intended data rate as this will minimize data distortion. Demod BW is set at 9700Hz @ 315MHz as default (assuming both SEL0 and SEL1 pins are floating). The low pass filter can be hardware set by external pins SEL0 and SEL1. SEL0 SEL1 Demod BW (@ 315MHz) 0 0 1180Hz 1 0 2360Hz 0 1 4270Hz 1 1 9400Hz - default Table 1. Demodulation BW Selection Slicer, Slicing Level and Squelch The signal, prior to slicer, is still linear demodulated AM. Data slicer converts this signal into digital “1”s and “0”s by comparing with the threshold voltage built up on the CTH capacitor. This threshold is determined by detecting the positive and negative peaks of the data signal and storing the mean value. Slicing threshold default is 50%. After the slicer, the signal becomes digital OOK data. During long periods of “0”s or no data period at all, threshold voltage on the CTH capacitor may be very low. Large random noise spikes during this time may cause erroneous “1”s at DO pin. Squelch pin when pull down low will suppress these errors. AGC Comparator The AGC comparator monitors the signal amplitude from the output of the programmable low-pass filter. When the output signal is less than 750mV threshold, 1.5µA current is then sourced into the external CAGC capacitor. When the output signal is greater than 750mV, a 15µA current sink discharges the CAGC capacitor. The voltage, developed on the CAGC capacitor, acts to adjust the gain of the mixer and the IF amplifier to compensate for RF input signal level variation. Reference Control There are two components in Reference and Control sub-block: 1) Reference Oscillator and, 2) Control Logic through parallel Inputs: SEL0, SEL1, SHDN. Reference Oscillator V BIAS C C1 CC2 R 2 R 1 M1 gm M2 M3 IBIAS RO1 M4 RO2 Normally on C0 1 C 1 Startup Circuit Figure 2. Reference Oscillator Circuit The reference oscillator in the MICRF213 (reference Figure 2) uses a basic Colpitts crystal oscillator configuration with a MOS transconductor to provide negative resistance. All capacitors shown in the figure are integrated inside MICRF213. R01 and R02 are external pins of MICRF213. The user only need connect the reference oscillation crystal. Reference oscillator crystal frequency can be calculated thus as: FREFOSC = FRF/(32 + 1.1/12) For 315MHz, FREFOSC = 9.81563 MHz. To operate the MICRF213 with minimum offset, crystal frequencies should be specified with 10pF loading capacitance. |
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