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H838024R Datasheet(PDF) 51 Page - Renesas Technology Corp

Part # H838024R
Description  Renesas 8-Bit Single-Chip Microcomputer Super Low Power Series
PDF  697 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

H838024R Datasheet(HTML) 51 Page - Renesas Technology Corp

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Section 1 Overview
Rev. 7.00 Mar 10, 2005 page 9 of 652
REJ09B0042-0700
1.3
Pin Arrangement and Functions
1.3.1
Pin Arrangement
The H8/38024 Group, H8/38024R Group, H8/38024S Group, and H8/38124 Group pin
arrangements are shown in figures 1.2, 1.3, and 1.4. The bonding pad location diagram of the
HCD64338024, HCD64338023, HCD64338022, HCD64338021, and HCD64338020 is shown in
figure 1.5. The bonding pad coordinates of the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020 are given in table 1.2. The bonding pad location diagram of
the HCD64F38024, HCD64F38024R is shown in figure 1.6. The bonding pad coordinates of the
HCD64F38024 are given in table 1.3. The bonding pad location diagram of the HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure 1.7.
The bonding pad coordinates of the HCD64338024S, HCD64338023S, HCD64338022S,
HCD64338021S, and HCD64338020S are given in table 1.4.
FP-80A, TFP-80C
(Top view)
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
P30/UD
P31/TMOFL
P32/TMOFH
P33
P34
P35
P36/AEVH
P37/AEVL
P40/SCK32
P41/RXD32
P42/TXD32
P43/IRQ0
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3/IRQ1/TMIC
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
P83/SEG28
P82/SEG27
P81/SEG26
P80/SEG25
P77/SEG24
P76/SEG23
P75/SEG22
P74/SEG21
P73/SEG20
P72/SEG19
P71/SEG18
P70/SEG17
P67/SEG16
P66/SEG15
P65/SEG14
P64/SEG13
P63/SEG12
P62/SEG11
P61/SEG10
P60/SEG9
Note: If the on-chip emulator is used, pins 95, 33, 34, and 35 are reserved for the emulator and not available to the user.
Figure 1.2(1) Pin Arrangement (FP-80A, TFP-80C: Top View,
H8/38024 Group, H8/38024R Group, H8/38024S Group)



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