MPQ5872

– 42V LOAD DUMP, 60mΩ 1-CHANNEL, SMART HS LOAD SWITCH, AEC-Q100

MPQ5872 Rev. 1.0

MonolithicPower.com

21

10/25/2023

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scenario, MCU series resistors, ground network

or an external freewheeling circuit is required

(see Figure 11).

MPQ5872

DIAG_EN

EN

FT/CS

MCU

RCL

RCS

OUT

VIN

Load

RSER

CSS

GND

ILIM

SS

CCS

RSER

RSER

RGND

DGND

Power

Supply

MCU IO Protection

Freewheeling

Circuit

Grounding Network

CCS

Figure 11: Loss of Power Supply Protection

Reverse Polarity Protection

A diode between the device GND and module

ground is required to block possible reverse

voltage, which also causes a ground shift (about

600mV). Ensure that RCL and CSS are properly

connected to the device GND in the event that a

GND voltage shift occurs. For inductive loads, a

negative spike may occur during the off state,

which may damage the diode. Therefore, it is

strongly recommended to add a 1k

Ω resistor in

parallel with the diode when driving an inductive

load to help protect the diode in parallel. The

diode’s IF should be greater than 100mA.

MPQ5872

DIAG_EN

EN

MCU

RCL

OUT

VIN

Load

CSS

GND

ILIM

SS

RSER

RSER

RGND

DGND

Power

Supply

MCU IO Protection

Grounding Network

FT/CS

RCS

CCS

CCS

RSER

Figure 12: Reverse Polarity Battery Protection

AEC Q100-012 Test Grade A Certification

Short-circuit reliability is critical for smart high-

side power MOSFET devices. The AEC-Q100-

012 standard is used to determine device

reliability when operating in a continuous short-

circuit condition. Different grade levels are

specified according to the pass cycles. This

device is qualified with the highest level, Grade

A, which indicates 1 million times short-to-GND

certification.

Applicable Test Modes

• Cold repetitive short-circuit test (long pulse)

• Cold repetitive short-circuit test (short pulse)

• Hot repetitive short-circuit test (continuous)

Transient Disturbances Tests

The MPQ5872 meets requirements specified in

ISO 7637-2 and ISO 16750-2 standards with

proper external circuitry (see Figure 13). Table 2

shows additional details.

Table 2: Tests in ISO 7637-2 and ISO 16750-2

Standard

Test Item

Level

Description

7637-2

1

III

-112V / 2ms

2a

III

55V / 50µs

2b

IV

10V / RIN

(0Ω)

3a

IV

-220V / 0.1µs

3b

IV

150V / 0.1µs

16750-2

Load dump test

B

US* = 40V

tR

≤ 5ms

Reverse

polarity voltage

US = -30V

t < 60s

If the CL is reached during a load dump

transient, the device

shutdown. Therefore, the

load capacitor (CLOAD) should be selected based

on Equation (4):

LIMIT

LOAD

LOAD

II

C

SR

−



(4)

where ILIMIT is the lower one of the internal and

external current limit, ILOAD is the load current,

and SR is the slew rate of the source voltage.

Based on the load dump pulse definition, SR

must be no greater than 20V/ms. Therefore, for

an application with 3A current limit and 2A

continuous current, it is recommended CLOAD to

be no more than 47µF.

MPQ5872

DIAG_EN

EN

MCU

RCL

OUT

VIN

Load

CSS

GND

ILIM

SS

Power

Supply

BAV21W

10k

Ω

10k

Ω

SMBJ24CA

22nF

COUT

100nF

FT/CS

RCS

CCS

CCS

10k

Ω

Figure 13: Pulse Test Circuit