MPQ5872

– 42V LOAD DUMP, 60mΩ 1-CHANNEL, SMART HS LOAD SWITCH, AEC-Q100

MPQ5872 Rev. 1.0

MonolithicPower.com

24

10/25/2023

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2023 MPS. All Rights Reserved.

PCB Layout Guidelines

For optimal thermal performance and reliability,

refer to Figure 18 follow the guidelines below

when designing the PCB layout:

1. Increase the copper area on the PCB

(especially for VIN, OUT, and GND) to

increase the thermal conductivity of the

board.

2. Connect the GND pin to the GND planes

beneath the IC using as many vias as

possible to further improve heat dissipation.

3. If a GND network is needed, use a single

copper layer for the

IC’s GND plane. Then

connect the IC’s and module’s GND pins via

protective components.

VIN

GND

OUT

MPQ5872

(a) Without GND Network

IC_GND

MODULE_GND

GND_

NETWORK

OUT

VIN

GND

MPQ5872

(b) With GND Network

Figure 18: Recommended PCB Layout