MPQ5872

– 42V LOAD DUMP, 60mΩ 1-CHANNEL, SMART HS LOAD SWITCH, AEC-Q100

MPQ5872 Rev. 1.0

MonolithicPower.com

4

10/25/2023

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© 2023 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1

VIN

Input power supply. Connect this pin to the battery.

2

DIAG_EN

Enable diagnostics. Pull this pin above the specified threshold (1.2V) to enable

diagnostics. Pull it below the specified threshold (1V) to disable diagnostics and reduce the

standby current. Connect this pin to GND if not used.

3

EN

Enable. Pull EN above the specified threshold (1.2V) to enable the chip. Pull EN below the

specified threshold (1V) to shut down the chip.

4

FT/CS

Fault/current sense. A current mirror is used to source 1 / KCS of the load current, flowing

to the external current-sense resistor (RCS) between FT/CS and GND. The voltage on the

FT/CS pin (VCS) reflects the load current. This pin also reports faults. Add a 100nF capacitor

as close as possible to the the FT/CS pin. If the current sense feature is not used, remove

RCS.

5

GND

Device ground.

6

ILIM

Configurable current limit pin. Connect this pin to GND via a resistor (RCL) to set the

external current limit. See the Operation section on page 17 for more details. If the external

current limit its not used, connect this pin directly to GND. Do not float this pin.

7

SS

Soft start. An external capacitor connected to this pin sets the output voltage (VOUT) slew

rate for the soft start (SS) period.

8

OUT

Output to the load. N-channel MOSFET source.

ABSOLUTE MAXIMUM RATINGS (1)

VIN, OUT ......................................-0.3V to +42V

All other pins ................................-0.3V to +6.5V

Junction temperature (TJ) .........................150°C

Lead temperature .....................................260°C

Storage temp ........................... -65°C to +150°C

Continuous power dissipation (2) (7)........... 4.46W

Inductive load switch-off energy dissipation,

Single pulse (3) ........................................... 50mJ

ESD Ratings

Human body model (HBM) ................. Class 2 (4)

Charged-device model (CDM) ....... Class C2b (5)

Recommended Operating Conditions

Continuous supply voltage (VIN)..........5V to 28V

Maximum load dump voltage ....................... 42V

Nominal DC load current....................... 0A to 2A

Operating junction temp (TJ) .... -40°C to +150°C

Thermal Resistance

θJA

θJC

QFN-8 (2mmx2.5mm)

JESD51-7

……………….67.2…13.6……°C/W(6)

EVQ5872-RP-00A

……...28………….....°C/W(7)

ΨJT

JESD51-7

………………………...4.9…....°C/W(6)

EVQ5872-RP-00A

………............4.0…....°C/W(7)

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can cause excessive die temperature, and the

regulator may go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) Test conditions: VIN = 13.5V, L = 10mH, R = 0Ω, TA = 25°C.

Derived from bench characterization. Not tested in production.

4) Per AEC-Q100-002.

5) Per AEC-Q100-011.

6) Obtained based on a JESD51-7, 4-layer PCB. The values

given in this table are only valid for comparison with other

packages and cannot be used for design purposes. These

values were calculated in accordance with JESD51-7, and

simulated on a specified JEDEC board. They do not represent

the performance obtained in an actual application, the value of

θ

JC shows the thermal resister from junction-to-case bottom,

and the value of

Ψ

JT shows the characterization parameter

from junction-to-case top.

7) Measured

on

an

MPS

MPQ5872

standard

EVB:

6.35cmx6.35cm, 2oz copper thickness, 4-layer PCB. The value

of

Ψ

JT shows the characterization parameter from junction-to-

case top.