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ADS5232 Datasheet(PDF) 24 Page - Texas Instruments |
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ADS5232 Datasheet(HTML) 24 Page - Texas Instruments |
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24 / 29 page ![]() www.ti.com LAYOUT AND DECOUPLING ADS5232 SBAS294A – JUNE 2004 – REVISED MARCH 2006 output buffer supply pins, VDRV. In order to minimize CONSIDERATIONS the lead and trace inductance, the capacitors should be located as close to the supply pins as possible. Proper grounding and bypassing, short lead length, Where double-sided component mounting is allowed, and the use of ground planes are particularly they are best placed directly under the package. In important for high frequency designs. Achieving addition, larger bipolar decoupling capacitors (2.2 µF optimum performance with a fast sampling converter to 10 µF), effective at lower frequencies, may also be such as the ADS5232 requires careful attention to the used on the main supply pins. They can be placed on printed circuit board (PCB) layout to minimize the the PCB in proximity (< 0.5") to the ADC. effects of board parasitics and to optimize component placement. A multilayer board usually ensures best If the analog inputs to the ADS5232 are driven results and allows convenient component placement. differentially, it is especially important to optimize towards a highly symmetrical layout. Small trace The ADS5232 should be treated as an analog length differences may create phase shifts, component and the supply pins connected to clean compromising a good distortion performance. For this analog supplies. This layout ensures the most reason, the use of two single op amps rather than consistent performance results, since digital supplies one dual amplifier enables a more symmetrical layout often carry a high level of switching noise, which and a better match of parasitic capacitances. The pin could couple into the converter and degrade device orientation of the ADS5232 quad-flat package follows performance. As mentioned previously, the output a flow-through design, with the analog inputs located buffer supply pins (VDRV) should also be connected on one side of the package while the digital outputs to a low-noise supply. Supplies of adjacent digital are located on the opposite side. This design circuits may carry substantial current transients. The provides a good physical isolation between the supply voltage should be filtered before connecting to analog and digital connections. While designing the the VDRV pin of the converter. All ground pins should layout, it is important to keep the analog signal traces directly connect to an analog ground. separated from any digital lines to prevent noise coupling onto the analog portion. Because of its high sampling frequency, the ADS5232 generates high frequency current transients Single-ended clock lines must be short and should and noise (clock feed-through) that are fed back into not cross any other signal traces. the supply and reference lines. If not sufficiently bypassed, this feed-through adds noise to the Short circuit traces on the digital outputs will minimize conversion process. All AVDD pins may be bypassed capacitive loading. Trace length should be kept short with 0.1 µF ceramic chip capacitors (size 0603, or to the receiving gate (< 2") with only one CMOS gate smaller). A similar approach may be used on the connected to one digital output. 24 Submit Documentation Feedback |
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