RT9301 datasheet(4/9 Pages) RICHTEK

4 / 9 page

RT9301

DS9301-02

March 2007

www.richtek.com

Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for

stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the

operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended

periods may remain possibility to affect device reliability.

Note 2. Devices are ESD sensitive. Handling precaution recommended.

Note 3. The device is not guaranteed to function outside its operating conditions.

Note 4.

θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of

JEDEC 51-3 thermal measurement standard.

Electrical Characteristics

Parameter

Symbol Test Condition

Min

Typ

Max

Units

Input Supply Voltage

VIN

2.8

5.5

UVLO Threshold

VUVLO_L

Falling

2.2

2.4

UVLO Hysteresis

100

Dropout Voltage

VLED

90% of ILED = 12mA

120

ISET Reference Voltage

0.8

0.9

Quiescent Current

LED Open, ISET = 20 uA

0.5

ILED Matching

ILED = 16mA

−5

ILED Accuracy

ILED

ILED = 16mA

−5

Shutdown current

All VSET1~3 < 0.25V

0.1

μA

VSET Enable Threshold

VSET

VSET connect RSET = 47kΩ to ISET

1.3

VSET Disable Threshold

VIL

VSET connect RSET = 47kΩ to ISET

0.25

(VIN = 3.6V, TA = 25

°C, Unless Otherwise specification)

Absolute Maximum Ratings (Note 1)

Supply Input Voltage ------------------------------------------------------------------------------------------------------

−0.3V to 6V

Other I/O Pin Voltages ---------------------------------------------------------------------------------------------------

−0.3V to 6V

Power Dissipation, PD @ TA = 25

°C

TSOT-23-8 ------------------------------------------------------------------------------------------------------------------- 0.382W

Package Thermal Resistance (Note 4)

TSOT-23-8,

θJA ------------------------------------------------------------------------------------------------------------- 262°C/W

Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260

°C

Junction Temperature ---------------------------------------------------------------------------------------------------- 150

°C

Storage Temperature Range --------------------------------------------------------------------------------------------

−65°C to 150°C

ESD Susceptibility (Note 2)

HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV

MM (Machine Mode) ------------------------------------------------------------------------------------------------------ 200V

Recommended Operating Conditions (Note 3)

Junction Temperature Range --------------------------------------------------------------------------------------------

−40°C to 125°C

Ambient Temperature Range --------------------------------------------------------------------------------------------

−40°C to 85°C

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