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RT9301 Datasheet(PDF) 7 Page - Richtek Technology Corporation

Part # RT9301
Description  3-Channel Low Dropout RGB LED Driver
PDF  9 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT9301 Datasheet(HTML) 7 Page - Richtek Technology Corporation

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RT9301
7
DS9301-02
March 2007
www.richtek.com
GPIO Control
Figure 4 shows an application circuit for backlight with
GPIO. The three setting resistors are connected to GPIO.
The LED current can be controlled by GPIO directly. The
RT9301 provides low dropout voltage and 5% maximum
current matching. It also allows dimming control frequency
up to 10kHz.
The LED current can be set at different value with proper
setting resistor. For typical application of GPIO 1.8V/2.8V
and LED current 15mA/20mA, the recommended current
setting resistors are showed as below table.
Figure 5 shows another application circuit for keypad
backlight with GPIO. There are 9 LEDs operation in parallel.
A battery or a regulated power source drives the LEDs.
Each channel supports three LEDs. The LED brightness
adjustment can be set with proper setting resistor for each
channel and be controlled from GPIO.
Thermal Considerations
The Rt9301 can support LED current up to 50mA over the
operation junction temperature range. However, the
maximum current must be derated at higher ambient
temperature to ensure the junction temperature does not
exceed 125
°C. With all possible conditions, the junction
temperature must be within the range specified under
recommended operating conditions. The power dissipation
can be calculated based on the LED current and the voltage
drop across the regulator.
PD =
∑ (VIN -VFLED) x ILED + VIN x IQ
where VIN is input voltage, VFLED is the forward voltage of
LED, ILED is the current of LED, and IQ is the quiescent
current of this chip.
For continuous operation, do not exceed the maximum
operation junction temperature 125
°C. The maximum power
dissipation depends on the thermal resistance of IC
package, PCB layout, the rate of surroundings airflow and
temperature difference between junction and ambient. The
maximum power dissipation can be calculated by following
formula:
PD(MAX) = ( TJ(MAX)
− TA ) / θJA
Where TJ(MAX) is the maximum operation junction
temperature 125
°C, TAis the ambient temperature and the
θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9301, where TJ(MAX) is the maximum junction
temperature of the die (125
°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance
θJA is layout dependent. For TSOT-23-8
packages, the thermal resistance
θJA is 262°C/W on the
standard JEDEC 51-3 single-layer thermal test board. The
maximum power dissipation at TA= 25
°C can be calculated
by following formula:
PD(MAX) = (125
°C − 25°C) / 262°C/W = 0.382 W for TSOT-
23-8 packages
Table 1. RSET Value Selection
GPIO
(V)
ILED
(mA)
RSET
(kΩ)
Nearest Standard Values for
RSET (kΩ)
15
48
47.5
1.8
20
36
36
15
101
100
2.8
20
76
75
V
BAT
1uF
LED3
LED2
LED1
ISET1
VIN
ISET3
ISET2
RT9301
R
SET3
R
SET2
R
SET1
GPIO
GND
Figure 5. Application Circuit for Keypad Backlight
LED3
LED2
LED1
GND
ISET1
V
BAT
VIN
ISET3
ISET2
R
SET3
R
SET2
GPIO
RT9301
R
SET1
1uF
Figure 4. Application Circuit for Backlight with GPIO



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