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RT9301 Datasheet(PDF) 7 Page - Richtek Technology Corporation |
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RT9301 Datasheet(HTML) 7 Page - Richtek Technology Corporation |
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7 / 9 page ![]() RT9301 7 DS9301-02 March 2007 www.richtek.com GPIO Control Figure 4 shows an application circuit for backlight with GPIO. The three setting resistors are connected to GPIO. The LED current can be controlled by GPIO directly. The RT9301 provides low dropout voltage and 5% maximum current matching. It also allows dimming control frequency up to 10kHz. The LED current can be set at different value with proper setting resistor. For typical application of GPIO 1.8V/2.8V and LED current 15mA/20mA, the recommended current setting resistors are showed as below table. Figure 5 shows another application circuit for keypad backlight with GPIO. There are 9 LEDs operation in parallel. A battery or a regulated power source drives the LEDs. Each channel supports three LEDs. The LED brightness adjustment can be set with proper setting resistor for each channel and be controlled from GPIO. Thermal Considerations The Rt9301 can support LED current up to 50mA over the operation junction temperature range. However, the maximum current must be derated at higher ambient temperature to ensure the junction temperature does not exceed 125 °C. With all possible conditions, the junction temperature must be within the range specified under recommended operating conditions. The power dissipation can be calculated based on the LED current and the voltage drop across the regulator. PD = ∑ (VIN -VFLED) x ILED + VIN x IQ where VIN is input voltage, VFLED is the forward voltage of LED, ILED is the current of LED, and IQ is the quiescent current of this chip. For continuous operation, do not exceed the maximum operation junction temperature 125 °C. The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction and ambient. The maximum power dissipation can be calculated by following formula: PD(MAX) = ( TJ(MAX) − TA ) / θJA Where TJ(MAX) is the maximum operation junction temperature 125 °C, TAis the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of RT9301, where TJ(MAX) is the maximum junction temperature of the die (125 °C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance θJA is layout dependent. For TSOT-23-8 packages, the thermal resistance θJA is 262°C/W on the standard JEDEC 51-3 single-layer thermal test board. The maximum power dissipation at TA= 25 °C can be calculated by following formula: PD(MAX) = (125 °C − 25°C) / 262°C/W = 0.382 W for TSOT- 23-8 packages Table 1. RSET Value Selection GPIO (V) ILED (mA) RSET (kΩ) Nearest Standard Values for RSET (kΩ) 15 48 47.5 1.8 20 36 36 15 101 100 2.8 20 76 75 V BAT 1uF LED3 LED2 LED1 ISET1 VIN ISET3 ISET2 RT9301 R SET3 R SET2 R SET1 GPIO GND Figure 5. Application Circuit for Keypad Backlight LED3 LED2 LED1 GND ISET1 V BAT VIN ISET3 ISET2 R SET3 R SET2 GPIO RT9301 R SET1 1uF Figure 4. Application Circuit for Backlight with GPIO |
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