LTM8065 datasheet(9/43 Pages) AD

9 / 43 page

Data Sheet

LTM8060F

analog.com

Rev. 0

9 of 43

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 5. Pinout Configuration

Pin Descriptions

Table 4. Pin Descriptions

NAME

DESCRIPTION

CFG 1

Bank

GND

Connect these GND pins to a local ground plane below the LTM8060F and the circuit

components. In most applications, the bulk of the heat flow out of the LTM8060F is

through these pads, so the printed circuit board (PCB) design has a large impact on

the thermal performance of the device. See the PCB Layout and Thermal

Considerations sections for more details. Return the feedback divider (RFB) to this

net.

PSGA PACKAGE

165-PIN (16mm × 11.9mm × 2.9mm)

TJMAX = 125°C; θJA = 8.4°C/W;

θJC_top = 4.6°C/W; θJC_bottom = 1°C/W; WEIGHT = 1.89g

BANK3

VOUT2

BANK1

VOUT3

BANK7

VOUT4

BANK5

VIN34

BANK4

VIN2

BANK6

VIN1

BANK8

VOUT1

GND

SHARE3

SHARE4

FB1

RT12 TRSS2 TRSS1

FB2

SHARE2

SHARE1

AUX2 BIAS12 AUX1

RUN2

RUN1

SYNC12

PG2

DNC

PG1

CLKOUT12

BIAS34 AUX4

AUX3

TRSS4 RT34

FB4

FB3

TRSS3

PG4 CLKOUT34

DNC

PG3

RUN4 SYNC34

RUN3

BANK2

TOP VIEW

θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS.

θJA VALUE IS OBTAINED WITH DEMO BOARD.

SEE THE TYPICAL PERFORMANCE CHARACTERISTICS SECTION FOR LAB MEASURED DER ATING CURVES.

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