IL422

7

NVE Corporation

11409 Valley View Road, Eden Prairie, MN 55344-3617

Phone: (952) 829-9217

www.nve.com

youtube.com/NveCorporation

iso-apps@nve.com

Insulation Specifications

Parameters

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Creepage Distance

8.08

mm

Barrier Impedance

>1014||7

Ω

|| pF

Leakage Current

0.2

μ

A

240 VRMS, 60 Hz

Thermal Characteristics

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Junction–Ambient Thermal Resistance

θ

JA

67

°C/W

Double-sided PCB in

free air

Junction–Case (Top)

Thermal Resistance

θ

JC

12

Junction–Ambient

Thermal Resistance

θ

JA

46

2s2p PCB in free air

per JESD51

Junction–Case (Top)

Thermal Resistance

θ

JC

9

Power Dissipation

PD

1500

mW

Notes:

1.

All voltage values are with respect to network ground except differential I/O bus voltages.

2.

Differential input/output voltage is measured at the noninverting terminal A with respect to the inverting terminal B.

3.

Skew limit is the maximum propagation delay difference between any two devices at 25°C.

4.

The power-off measurement in ANSI Standard EIA/TIA-422-B applies to disabled outputs only and

is not applied to combined inputs and outputs.

5.

All typical values are at VDD1= 3.3 V or 5 V and VDD2 = 5 V, and TA = 25°C.

6.

The minimum VOD2 with a 100 Ω load is either ½ VOD1 or 2 V, whichever is greater.

7.

Δ

|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively,

that occur when the input is changed form one logic state to the other.

8.

This applies for both power on and power off, refer to ANSI standard RS-485 for exact condition.

The EIA/TIA-422-B limit does not apply for a combined driver and receiver terminal.

9.

Includes 8 ns read enable time. Maximum propagation delay is 25 ns after read assertion.

10. Pulse skew is defined as |tPLH − tPHL| of each channel.

11. The relevant test and measurement methods are given in the Electromagnetic Compatibility section.

12. External magnetic field immunity is improved by this factor if the field direction is “end-to-end” rather than to “pin-to-pin.”