IL4822 / IL4622 / IL4685

8

NVE Corporation

11409 Valley View Road, Eden Prairie, MN 55344

(952) 829-9217

www.nve.com

YouTube.com/NveCorporation

iso-apps@ www.nve.com

Shutdown Specifications

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

DC-to-DC convertor

Overcurrent threshold

IDD2A

120

mA

Brownout threshold voltage

VDD2B

2.5

V

Power-up

2.3

Power-down

Bus driver shutdown temperature

Bus driver re-enable temperature

TJ

140

°C

Junction Temperature

135

Isolation Specifications

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Creepage distance (external)

8.03

8.3

mm

Per IEC 60601

Total barrier thickness (internal)

0.013

0.016

mm

Barrier resistance

RIO

>1014

Ω

500 VRMS

Barrier capacitance

CIO

7

pF

f = 1 MHz

Leakage current

0.2

μARMS

240 VRMS, 60 Hz

Comparative tracking index

CTI

≥600

VRMS

Per IEC 60112

Barrier life

44000

Years

100°C, 1000 VRMS, 60%

CL activation energy

Thermal Characteristics

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Junction–ambient

thermal resistance

θ

JA

67

°C/W

Double-sided PCB with

thermal vias in free air

Junction–case (top)

thermal resistance

θ

JC

12

Junction–ambient

thermal resistance

θ

JA

46

2s2p PCB with thermal

vias per JESD51 with

thermal vias in free air

Junction–case (top)

thermal resistance

θ

JC

9

Power dissipation

PD

1.5

W

Notes:

1.

Absolute Maximum specifications mean the device will not be damaged if operated under these conditions. It does not guarantee

performance.

2.

Differential input/output voltage is measured at the noninverting terminal A with respect to the inverting terminal B.

3.

Δ|VOD| and Δ|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from one logic state to

the other.

4.

Includes 10 ns read enable time. Maximum propagation delay is 25 ns after read assertion.

5.

Pulse skew is defined as |tPLH – tPHL| of each channel.

6.

Skew limit is the maximum propagation delay difference between any two devices at 25°C.

7.

The relevant test and measurement methods are given in the “High Magnetic Immunity” section on p. 11.

8.

External magnetic field immunity is improved by this factor if the field direction is “end-to-end” rather than to “pin-to-pin” (see diagram on p. 14).