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MIC4607A Datasheet(PDF) 35 Page - Microchip Technology |
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MIC4607A Datasheet(HTML) 35 Page - Microchip Technology |
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35 / 41 page ![]() 2024 Microchip Technology Inc. and its subsidiaries DS-20006957A-page 35 MIC4607A RECOMMENDED LAND PATTERN Dimension Limits Units C2 Center Pad Width Contact Pad Spacing Center Pad Length Contact Pitch Y2 X2 3.50 2.50 MILLIMETERS 0.50 BSC MIN E MAX 4.90 Contact Pad Length (X28) Contact Pad Width (X28) Y1 X1 0.85 0.30 NOM 1 2 28 C1 Contact Pad Spacing 3.90 Contact Pad to Contact Pad (X24) G2 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Contact Pad to Center Pad (X28) G1 0.28 28-Lead Very Thin Plastic Quad Flat, No Lead Package (HPB) - 4x5x1.0 mm Body [VQFN] With 2.4x3.4 mm Exposed Pad and Stepped Wettable Flanks Microchip Technology Drawing C04-23564 Rev B E X1 Y1 G1 G2 ØV X2 Y2 EV EV C1 C2 SILK SCREEN |
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