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2016L030 Datasheet(PDF) 17 Page - Littelfuse

Part # 2016L030
Description  POLYFUSE짰 Resettable PTCs Surface Mount
PDF  74 Pages
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Manufacturer  LITTELFUSE [Littelfuse]
Direct Link  http://www.littelfuse.com
Logo LITTELFUSE - Littelfuse

2016L030 Datasheet(HTML) 17 Page - Littelfuse

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POLYFUSE® Resettable PTCs
Surface Mount
www.littelfuse.com
©2006 Littelfuse
8
Electronics Designers Guide
8L Series
Specifications are subject to change without notice.
Environmental Specifications
Soldering Parameters
Condition
Reflow
Peak Temp/ Duration Time
260°C/10Sec
Time above liquids (TAL) 220°C
60Sec~100Sec
Preheat 120°C~ 180°C
50Sec~150Sec
Storage Condition
0°C~35°C,<
=70%RH
•Recommendedreflowmethods:IR,vaporphaseoven,hotair
oven,N
2environmentforlead-free
•Devicesarenotdesignedtobewavesolderedtothebottomside
oftheboard.
•Recommendedmaximumpastethicknessis0.25mm(0.010inch)
•Devicescanbecleanedusingstandardindustrymethodsand
solvents.
Note:Ifreflowtemperaturesexceedtherecommendedprofile,
devicesmaynotmeettheperformancerequirements.
Operating/Storage
Temperature
-40°Cto+85°C
Maximum Device Surface
Temperature in Tripped State
125°C
Passive Aging
+85°C,1000hours
±5%typicalresistancechange
Humidity Aging
+85°C,85%R.H.1000hours
±5%typicalresistancechange
Thermal Shock
MIL-STD-202Method107G
+85°C/-40°C20times
-30%typicalresistancechange
Solvent Resistance
MIL-STD-202,Method215
Nochange
Vibration
MIL-STD-883C,Method
2007.1,ConditionA
Nochange
Physical Specifications
Terminal Material
Solder-PlatedCopper(SolderMaterial:
MatteTin(Sn))
Lead Solderability
MeetsEIASpecificationRS186-9E,ANSI/
J-STD-002Category3.
Preheating
120
180
220
260
0
60 to 100
Soldering
Cooling
120
50 to 150
Time(s)



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