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FXP830 Datasheet(PDF) 13 Page - Panasonic Semiconductor |
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FXP830 Datasheet(HTML) 13 Page - Panasonic Semiconductor |
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13 / 50 page  PAN9019 / PAN9019A Wi-Fi and Bluetooth Module 3 PAN9019 / PAN9019A Module Module Integration Guide Rev. 1.0 Page 13 of 50 3.4 Solder Resist Mask and Solder Paste Stencil It is recommended to use the following layout for the solder resist mask and the solder paste stencil to reduce voids on the pads. The following dimensions are recommended: ✓ The solder resist mask should be 50 µm bigger (circumferential) than the pad size (non-sol- der-mask-defined design). ✓ The solder paste stencil apertures should have the same size as the copper pads; they are separated in two semi circles with 300 µm distance and are shifted about 150 µm towards the outside. For details on the dimensions of the copper pads please refer to 3.3 Footprint. Solder Paste Stencil Layout |
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